Testing Services
- Test
Semiconductor test
Analysis and tests on wafers, packages, printed board assemblies (PBAs)
and electronic systems - all from one source.
High volume wafer test
- Qualifications/ Upscreening according to
AEC-Q, ESCC, DIN, IEC, Telcordia, MIL, JEDEC, IEC
- Failure analysis
- Reliability / Component Engineering
- Logistics / Supply Chain Mgmt
- Test Engineering
DFT, DFM, Test software & hardware development
Platforms Advantest, Credence, Teradyne, Verigy
Services
- Engineering
- Test + Programming
- Supply Chain Management
- Qualification
- Failure Analysis
- Consulting
Test Engineering
- Design for Test, Design for Manufacturing
- Test software & hardware development
- Platforms Advantest, Credence, Teradyne, Verigy
Product Engineering
- Test time optimization & reduction
- Definition of yield roadmap
- Off-load & test-site transfers
Production Test and Programming
Functional, parametric & optoelectronic test of wafers and packaged devices
- From characterization to high volume test
- Automatic, multi-site, tri-temp handling
- Clean room class 1000
- RF-test up to 50 GHz
Device Programming
- Multi-site equipment
End of line – service
- Tape & Reel Service
- Ship to line
Test: Equipment
Various test systems and handling/ probing systems
- Credence
- Teradyne
- SZ
- Verigy (by partner)
Maximum safety by 2 test locations
- “ 2nd Source“
High volume test
Supply Chain Management
- Support from idea to realization
- Permanent quality monitoring
- Root cause analysis with in-house FA/QA lab
- Co-operation with wafer fabs and certified assembly subcontractors in Europe and Asia
- Optimal procurement by combining production volumes
Qualification and Burn-In
- Qualifications acc. to international standards
like AEC-Q, ESCC, Telcordia, MIL, JEDEC, IEC
- Component to board
- Optoelectronic devices
- Operating life test for ICs, LEDs, Laser Diodes, VCSELs
- Real-time monitoring Burn-In
- Climatic stress testing
- Mechanical stress testing
- ESD testing
- Solderability tests
- MSL classification
Failure- & Technology Analysis
Service from chip to assembled boards
- Internal physical inspection (IPI / DPA)
- First silicon debug and chip repair
- Focused Ion Beam (FIB) Services
- Customer return management
- Identity check
- Metallographic X-sectioning
- Material characterization
- Extensive microscopy:
- Light optical, SEM with EDX, SAM, X-ray
Service for optoelectronics
- Characterisation (Incoming inspection)
- Environmental tests
- Reliability / risk / failure analysis on
- Fiberoptics board-to-board and Ultra Long Haul
- Single components and modules
- POF components
- LD, VCSEL, IRED and LED
- Signal lamps, displays
- CMOS and CCD image sensors
Evaluation & Consulting
- Competence center for packages, interconnection technology,
printed circuit boards and printed board assembly
- Interconnection technology evaluation
- Process, product & supplier audits
- Life time prediction
- MTBF (Meantime Between Failure) calculation
- FIT (Failure In Time) rate calculation acc. WEIBULL
- ESD Services
- ESD Evaluation
- ESDFOS (ESD from outside to surface) evaluation
ESD & ESDFOS Evaluation
(ESDFOS = ESD From Outside to Surface)
- Risk identification
of production & production process
of equipment
depending on product sensitivity or customer requirements
- Guidance for equipment release
- Acceptance for production
- Equipment construction & maintenance
- Certification of equipment for suppliers
- ESD training
ESD + Reliability Evaluation/Consulting
- Team of Experts for
ESD- Evaluation
Printed Board Assemblies
Interconnection an Process technology
Optoelectronic Components and Modules
Audits
MTBF Calculation
