Assembly Packages:
  BGA, LGA, BT, Ceramic, MLP, SOT, SC, TSOT, SOD, TO,
  SOP, SOICN, SOICW, QSOP, SSOP, TSSOP, MSOP, PLCC, MQFP, LQFP, TQFP, QUAD…
Test Capability: RF, Digital, Analog, Mixed Signal
Failure Analysis & Reliability
SiP MCP : Substrate Assemblies

Leading provider of turnkey Packaging and Test Services to the semiconductor industry.
Offers one of the widest range package & test portfolios in the world.
Most experienced companies, and is recognized as one of the largest in unit volume production.
3 high technology factories.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment.
Ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries.
The factories maintain world-class quality standards having achieved ISO/TS 16949, SAC Level 1, ISO-9001, ISO-14001, QS-9000 certifications and comply to the Sony Green Partner Program.